Last Revised: September 17, 2018

Hydrogen peroxide, strong oxidizing acids such as nitric, perchloric and sulfuric acids and mixtures such as Piranha or Aqua Regia are used as etches to remove organic residues from silicon wafers and other materials. These chemicals are dangerous because of their strong corrosivity and the propensity of waste solutions to evolve gas due to oxidation of organics or decomposition. EHRS has responded to several incidents of container ruptures in the School of Engineering and Applied Sciences involving these waste materials. In a recent incident the waste bottle ruptured sending shards of glass and plastic through the lab.



Special care must be taken if you generate waste containing these chemicals. 

See the Fact Sheet on Gas-Producing Waste for details on how to properly collect this waste.